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Soldering fluxes and pastes Cleaning agents Multiple heat exposures Adhesives Underfills Temporary solder masks Tapes Anything else in assembly that depends upon the surface of the solder mask

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33.4.5.5 Conformal Coating Compatibility. Again, qualification of the solder mask, through all of the fabrication processes, is required to ensure that no problems with production boards arise. Since conformal coating is applied after assembly, a significant amount of processing and exposure to other chemistries will have happened since the solder mask has been applied. The conformal coating compatibility testing should be done on a board that has been through all of the assembly processing. The cleanliness of the PCB surface after the final assembly process has a great impact upon the adhesion of the conformal coating. One cannot

Fig 615: Illustration for calculation of the life of a bearing [5]

expect conformal coating to adhere well to a dirty board. These coatings were not meant to be applied over a no-clean flux, but over a clean substrate.

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Application Method for Installed Equipment Choose solder mask that is compatible with the existing or proposed application method. Not all solder masks can be screen printed, sprayed, and curtain-coated. Consult with the solder mask supplier for the appropriate solder mask for your application method.

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Gloss Solder masks are available in different levels of gloss. Typical terminology for finishes includes gloss, semigloss, satin or semimatte, and matte. These finishes represent a certain level of reflectivity of light and microroughness. Gloss level is generally specified by end users for assembly or cosmetic reasons.

Color Likewise, different levels of color may be available. Most solder mask is green, but many other colors, such as red, blue, black, yellow, and white, are often specified. Some solder masks are specified to be clear.

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Packaging versus PCB When solder mask is used on substrates that will become part of a semiconductor package. The JEDEC Solid State Technology Association (once known as the Joint Electron Device Engineering Council) specifications apply in addition to the IPC specifications. JEDEC specifications include additional, more aggressive testing that generally requires a more robust solder mask. Low moisture absorption is important for a mask used in packaging applications.

In sliding bearings, the bearing elements are usually separated by a film of lubricant that can be either a solid or a liquid and in which the sliding motion is the predominant element [6] This type of bearing is used whenever there is the need for long life, low cost, high-speed characteristics and noise-free operation Going back in time, the slider bearing was the first type of bearing to be used Figure 616 shows that the concept of lubrication for a sliding bearing existed during the ancient Egyptian era

Surface Finish Compatibility The choice of the final surface finish for the copper has an effect upon how the solder mask performs. And, with the elimination of lead in solder, the compatibility of new final finishes needs to be confirmed before their implementation. Most of these finishes are applied after the solder mask so the process for mask application can have a significant impact upon final quality of the PCB:

Hot air solder leveling (HASL) This has been the most common final finish, utilizing 63/37 eutectic or 60/40 tin/lead (Sn/Pb) alloys. The PCB is coated with flux, immersed into molten solder, and withdrawn through air knives to remove excess solder. Lead-free solders are expected to require solder temperatures significantly hotter than what has been required for eutectic solder. The higher temperatures are expected to place higher stress on the solder mask and may also present more difficult post-HASL cleaning challenges. Electroless nickel/immersion gold (ENIG) ENIG is typically applied to the metal surfaces of the PCB after the solder mask process. Each plating chemistry supplier has its own ENIG bath, and each has a different level of aggressiveness to the solder mask. Consequently, the solder mask and ENIG chemistry must be qualified together to avoid breakdown of the solder mask over circuits or around openings on metal. A thicker coating of

solder mask may alleviate solder mask breakdown problems. Excessive microetching before plating can undermine the solder mask and induce tape test failure as the overhanging mask is broken off. Immersion tin The same comments from ENIG also apply to immersion tin. Immersion silver Immersion silver is relatively benign to the solder mask, and few, if any, issues are known as of the writing of this book. Organic solderability preservative (OSP) This is another process and chemistry that has little impact on the solder mask.

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